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Ships within 48 hours · Estimated delivery Aug 27 - Sep 1
Ripple: 10mVrms
B-BOX adopts autonomous syscfg algorithm
solves the problem of repairing and fixing laptop motherboards
48MP version: Advanced camera version
HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Option:HMT-X1 Ripple: 10mVrmsHMT X1 ZJ X1 multi functional motherboard layered chip glue removal heating table for iPhone 16 15 14 13 12 11 X PCB layering tinning repair and chip glue removal. HMT X1 360W universal motherboard delamination and degumming heating table for mobile phone motherboard repair. Features: 1. Temperature control imported from Germany, rapid heating. 2. Turn on the chip degumming station temperature switch, the chip degumming station starts to heat up. 3.
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